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  Far East Journal of Mathematical Sciences (FJMS)  
 ISSN: 0972-0871
 
 
 

     Far East Journal of Mathematical Sciences (FJMS)
    Volume 28, Issue 3, Pages 667 - 680 (March 2008)


APPLICATION OF A THERMAL NETWORK METHOD TO NON-STEADY THERMAL ANALYSIS OF ELECTRONIC DEVICES

Masaru Ishizuka (Japan), Shinji Nakagawa (Japan), Tadashi Hachiga (Japan) and Hiroki Ishida (Japan)

Received November 29, 2007

References:



[1] M. Ishizuka and Y. Fukuoka, Development of a new high density package cooling technology using low melting point alloys, Proceedings of the ASME/JSME Thermal Engineering Joint Conference, 1991, pp. 375-380.

[2] M. Ishizuka and S. Nakagawa, Practical study of application of thermal network method to thermal design of electronic equipment (An example for the thermal design of a compact self-ballasted fluorescent lamp), Proceedings of IMECE2006: International Mechanical Engineering Congress and Exposition, Chicago, Illinois, USA, November, 5-10, 2006, IMECE2006-13105.

[3] S. Mochizuki, Y. Kudoh and T. Tsukada, The effect of heat transfer process on the print quality in thermal printers, JSME International Journal Ser. 2 31(3) (1988), 553-558.

[4] S. Mochizuki, M. Saito and N. Egashira, Heat transfer mechanisms and printing characteristics in thermal dye transfer printing, Proceedings of the ASME/JSME Thermal Engineering Joint Conference, 1991, pp. 413-420.

[5] S. Shibata, M. Ito and K. Nihei, Development of 16-dots/mm thermal printing head, IEEE Trans. Comp. Hybrids. Manuf. Technol. CHMT-7 3 (1984), 294-298.

[6] S. Shibata, T. Kanamori and N. Tsuruoka, Development of heating resistor for versatile thermal print heads, IEEE Trans. Comp. Hybrids. Manuf. Technol. 12(3) (1989), 358-364.

[7] Y. Tokunaga and K. Sugiyama, Thermal ink transfer imaging, IEEE Trans. Electron Devices ED-27(1) (1980), 218-222.

Keywords and phrases: application of a thermal network method, non-steady thermal analysis, thermal design, high speed thermal printers, thermal printer head.

 


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